Packaging Engineering Intern - Summer
Fab2 · On-site
MeritLog read this listing from Fab2's Ashby job board and last checked it on September 8, 2026.
Source: the employer's Ashby job board. Open the original listing for current details.
Job details
- Work model
- On-site
- Salary
- $108K - $126K
- Location
- Austin
Hiring context
How this role compares at Fab2
Fab2 has 57 live roles in MeritLog’s catalog across 5 job families, and 53 of them are in engineering. 31 of those listings publish a pay range, a disclosure rate of 54%.
This role's posted range of $108K - $126K sits above 0% of the 30 other Fab2 roles quoted over the same currency and period.
Fab2 concentrates this hiring in:
Counted across the job boards MeritLog tracks, at the time this page was served. Pay comparisons use only listings that publish a complete range in the same currency and period.
What the role asks for
What you'd do
- Design and iterate on machines and subsystems for semiconductor packaging fabrication, such as laser ablation machines, reflow ovens, and automated metal plating facilities
- Integrate mechanical, electrical, and optical components in system assembly, including wiring, optics alignment, and electronics
- Collaborate with cross-functional teams to continuously improve fabrication processes and equipment
- Hands-on package/wafer processing (3d printing, metal plating, lithography, metrology)
- Pursuing a Bachelor’s Degree or higher in engineering
- At least 1-2 hands-on wet lab or lab-adjacent experiences, ideally in metal plating work or fabricating devices
- Strong foundation in mechanical engineering (Solidworks/Onshape, materials selection, etc.)
- Hands-on prototyping experience and the ability to move through design cycles quickly
What they're asking for
- Proven experience in mechatronics or electromechanical system designSkillPreferred
- Familiarity with lasering and 3D printing (stereolithography)SkillPreferred
- Reliability testing, soldering, and reflow testingSkillPreferred
- Hands-on experience with nano-fabrication tools (etching, deposition, patterning) and metrology tools (SEM, thin film measurement, X-ray, etc.)SkillPreferred
Parsed by MeritLog from the employer’s own posting. The full description follows below.
Job description
About fab2 The fab2 team can build anything. We design all the hardware and software needed to make chips and we make the fabs, tools, and components ourselves. We're looking for exceptional, hands-on people who can iterate to the limits of what's possible. fab2 was founded by Sam Zeloof https://www.youtube.com/@SamZeloof and Jim Keller https://en.wikipedia.org/wiki/Jim_Keller_(engineer). Sam is best known for making chips in his garage, and Jim has been a leader in the semiconductor industry for the past 40 years. About the Role We’re hiring Semiconductor Packaging Engineering Interns for the summer term. The internship begins in May or June, with a preferred commitment of 4 to 8 months. We are a small team engaged in end-to-end process development and integration work for semiconductor packaging processes, providing exposure to interesting work that is hard to find at larger companies. This is a hands-on engineering role-meaning you will be actively involved in the research and development of new packaging technologies, including mechanical prototyping, experiment design, and data analysis. We train our interns on most of our tools and allow them to use these tools independently, including 3d printing, metal plating, lasering, and metrology. Our philosophy is to get things built and tested in days or weeks, not months. Because of this, a portfolio is required to apply: show us the things you’ve actually built! If you’ve shipped a medium-to-high complexity system through a personal project or previous internship, you’d be a good fit here. Responsibilities - Design and iterate on machines and subsystems for semiconductor packaging fabrication, such as laser ablation machines, reflow ovens, and automated metal plating facilities - Integrate mechanical, electrical, and optical components in system assembly, including wiring, optics alignment, and electronics - Collaborate with cross-functional teams to continuously improve fabrication processes and equipment - Hands-on package/wafer processing (3d printing, metal plating, lithography, metrology) Required Experience - Pursuing a Bachelor’s Degree or higher in engineering - At least 1-2 hands-on wet lab or lab-adjacent experiences, ideally in metal plating work or fabricating devices - Strong foundation in mechanical engineering (Solidworks/Onshape, materials selection, etc.) - Hands-on prototyping experience and the ability to move through design cycles quickly Nice-to-have - Proven experience in mechatronics or electromechanical system design - Familiarity with lasering and 3D printing (stereolithography) - Reliability testing, soldering, and reflow testing - Hands-on experience with nano-fabrication tools (etching, deposition, patterning) and metrology tools (SEM, thin film measurement, X-ray, etc.) Working at fab2 We’re an early-stage hardware startup with solid funding, world-class advisors, and labs/offices in Austin, TX, Lockhart, TX, and San Francisco, CA. fab2 is committed to fair and equitable compensation. Packaging Interns are paid hourly, at a rate equivalent to an annualized range of $108,000–$126,000 depending on experience and education. Actual earnings vary with hours worked. Internship Benefits: - Housing Stipend to help with first month expenses - Lunches daily, Dinners 3x per week, Stocked Office Kitchen with Snacks and Spindrifts - Weekly Learning & Development opportunities - Commuter Benefits including Parking and Late Night Uber rides from the office - Paid Time Off inclusive of Holidays and Sick Time - Visa Sponsorship - Medical, Dental, and Vision insurance - 401(k) retirement plan - Life and Disability Insurance We are an equal-opportunity employer and do not discriminate on the basis of race, religion, national origin, gender, sexual orientation, age, veteran status, disability or other legally protected statuses. Export Control Analysis: This position involves access to technology that is subject to U.S. export controls. Any job offer made will be contingent upon the applicant’s capacity to serve in compliance with U.S. export controls. fab2, formerly known as Atomic Semi
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